|
Subject Code: SCI 3421/2 Section No.: 00001 Time Allowed : 3 Hour(s) Subject Title: Material Science: Thin Films, Semiconductors I/II |
| Solutions
|
| 1. | The thinner of foil, the higher the concentration gradient, so the
greater will be the diffusional flux J.
Fick’s first law: |
| 2. | The higher the acceleration voltage V, the bigger the kinetic energy
of each electron E, the same for its momentum P, therefore the shorter
its wavelength R |
| 3. | The higher the temperature T, the faster the strain rate E, and the
shorter will be the rupture time, under the assumption that failure occurs
at the same value of strain. Arrhenius law for cheep:
E |
| 4. | The ceramic, which is more brittle than the alloy, contains cracks
that tend to open and propagate under tension (but not under compression.)
Griffith crack model: Where |
| 5. | Brilliance is proportional to the function of light reflected at the
air-diamond interface under specular reflection condition, R, and in turn
R Fresuel’s law for (near) normal incidence:
|
| 6. | The concentration of free electrons/holes (ne or np)
in intrinsic Si rises with temperature. The same, therefore, for conductivity
6 (under the assumption of uniform electron/hole mobility, which holds
approximately). Fermi function f(E) = [exp(E-Ef)/kT+1]-1,
where E is electron/hole energy, Ef the Fermic level (essentially
independent of temperature), k the Boltzmann constant, and T the temperature.
Multiplies into the density of state to give the concentration of free
electrons/holes,
ne = np. |
| 7. | i) The slip planes are:
(2 marks)Linear density of atoms along the ii) Angle between [100] and slip direction
so, resolved shear stress
iii)
= |
| 8. | a) T1 = 1010oC = 1283K
T2 = 759oC = 1032K T = Q /Rln ( (b)(c) so, T3 = 817K (544oC) T4 = 1053K (780oC) Tempering : See Shackelford p.330 |
< Back>